Semiconductor devices including a dummy gate structure on a fin

ABSTRACT

Semiconductor devices including a dummy gate structure on a fin are provided. A semiconductor device includes a fin protruding from a substrate. The semiconductor device includes a source/drain region in the fin, and a recess region of the fin that is between first and second portions of the source/drain region. Moreover, the semiconductor device includes a dummy gate structure overlapping the recess region, and a spacer that is on the fin and adjacent a sidewall of the dummy gate structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation application of and claimspriority from U.S. patent application Ser. No. 14/639,494, filed on Mar.5, 2015, which claims priority under 35 U.S.C. 119 to Korean PatentApplication No. 10-2014-0054924, filed on May 8, 2014 in the KoreanIntellectual Property Office, the entire contents of which are herebyincorporated herein by reference in their entireties.

BACKGROUND

The present disclosure relates to semiconductor devices. As one exampleof scaling techniques for increasing the density of integrated circuitdevices, a multi-gate transistor has been proposed, in which afin-shaped or nanowire-shaped silicon body is formed on a substrate anda gate is then formed on a surface of the silicon body. Because themulti-gate transistor uses a three-dimensional (3D) channel, scaling ofthe multi-gate transistor may be relatively easily achieved. Inaddition, current controlling capability can be improved even withoutincreasing a gate length of the multi-gate transistor. Further, a shortchannel effect (SCE), in which an electric potential of a channel regionis affected by a drain voltage, can be reduced.

SUMMARY

Various embodiments of present inventive concepts provide asemiconductor device that can improve its operating characteristics byinhibiting a short from occurring and allowing a source/drain region tobe subjected to epitaxial growth. According to various embodiments ofpresent inventive concepts, a semiconductor device may include a finprotruding from a substrate and extending in a direction. Thesemiconductor device may include a recess in the fin, and a deviceisolation layer filling the recess. The semiconductor device may includea dummy gate structure overlapping the device isolation layer, and firstand second spacers at opposite sides of the dummy gate structure on thefin. Moreover, the semiconductor device may include an inner spacer oninner sidewalls of the first and second spacers, and a source/drainregion at opposite sides of the recess and spaced apart from the deviceisolation layer.

In various embodiments, a first width of the recess may be narrower thana second width of the dummy gate structure. Moreover, a first bottomsurface of the recess may be lower than a second bottom surface of thesource/drain region.

According to various embodiments, the first spacer may include a firstregion and a second region on the first region, the second spacer mayinclude a third region and a fourth region on the third region, a firstwidth of the first region may be wider than a second width of the secondregion, and a third width of the third region may be wider than a fourthwidth of the fourth region. In some embodiments, a first distancebetween the first region and the third region may be shorter than asecond distance between the second region and the fourth region. In someembodiments, the inner spacer may be on sidewalls of each of the firstand third regions. Moreover, a profile of the recess and a profile ofthe inner spacer may be connected.

In various embodiments, the semiconductor device may include a cappinglayer between the recess and the device isolation layer and continuouslyextending adjacent a boundary of the recess. In some embodiments, thesemiconductor device may include a cover layer on a top surface of thedummy gate structure. Moreover, the first and second spacers may extendalong respective sidewalls of the cover layer.

According to various embodiments, a top surface of the device isolationlayer may protrude beyond or be coplanar with a top surface of the fin.Moreover, the device isolation layer may include a first region in therecess and a second region on the first region, and a first width of thefirst region may be narrower than a second width of the second region.

In various embodiments, the semiconductor device may include a firstgate structure and a second gate structure spaced apart from the dummygate structure at opposite sides, respectively, of the dummy gatestructure on the fin. Moreover, a bottom surface of the dummy gatestructure may be higher than or coplanar with respective bottom surfacesof the first and second gate structures.

A semiconductor device, according to various embodiments, may include afin protruding from a substrate and extending in a direction. Thesemiconductor device may include a recess in the fin, and a dummy gatestructure filling the recess. The semiconductor device may include firstand second gate structures at opposite sides of the dummy gatestructure, respectively. The first and second gate structures may bespaced apart from the dummy gate structure on the fin and may extendover the fin. The semiconductor device may include a first spacer on thefirst gate structure, a second spacer on the second gate structure, anda third spacer including respective portions on the opposite sides ofthe dummy gate structure. Moreover, the semiconductor device may includean inner spacer between the dummy gate structure and the third spacer.

In various embodiments, a first width of the recess may be narrower thana second width of the dummy gate structure on the recess. Moreover, thedummy gate structure may include a gate insulation layer, a barrierlayer and a gate electrode, and the gate electrode may be in the recess.

A semiconductor device, according to various embodiments, may include asubstrate that includes a first region and a second region. Thesemiconductor device may include a first fin protruding from thesubstrate and extending in a first direction on the first region. Thesemiconductor device may include a recess extending in a seconddirection different from the first direction in the first fin. Thesemiconductor device may include a dummy gate structure overlapping therecess and extending in the second direction. The semiconductor devicemay include second and third fins on the second region, protruding fromthe substrate, and extending in the first direction. Moreover, thesemiconductor device may include a trench between the second fin and thethird fin such that the second fin and the third fin are spaced apartfrom each other. A height and a width of the recess may be smaller thanthose of the trench.

In various embodiments, the height of the recess may be smaller thanthat of the fin, and the height of the trench is greater than that ofthe fin. Moreover, the semiconductor device may include a first deviceisolation layer filling the recess and a second device isolation layerfilling the trench.

A semiconductor device, according to various embodiments, may include afin protruding from a substrate, a source/drain region in the fin, and adevice isolation layer in a recess region of the fin that is between andspaced apart from first and second portions of the source/drain region.Moreover, the semiconductor device may include a dummy gate structureoverlapping the device isolation layer, and a spacer that is on the finand adjacent a sidewall of the dummy gate structure. In someembodiments, the semiconductor device may include first and second gatestructures on the fin, where the dummy gate structure is between thefirst and second gate structures. In some embodiments, the semiconductordevice may include a protective cover layer on the dummy gate structureand the first and second gate structures.

In various embodiments, the spacer may be a first spacer, and thesemiconductor device may include a second spacer that is on a sidewallof the first spacer and that undercuts a portion of the dummy gatestructure. Moreover, the device isolation layer may be tapered away fromthe dummy gate structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Example embodiments will be more clearly understood from the followingbrief description taken in conjunction with the accompanying drawings.The accompanying drawings represent non-limiting, example embodiments asdescribed herein.

FIG. 1 is a perspective view of a semiconductor device according to someembodiments of present inventive concepts;

FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1;

FIG. 3 is a cross-sectional view taken along the line B-B of FIG. 1;

FIG. 4 is a cross-sectional view taken along the line C-C of FIG. 1;

FIG. 5 is a perspective view of a semiconductor device according to someembodiments of present inventive concepts;

FIG. 6 is a perspective view of a semiconductor device according to someembodiments of present inventive concepts;

FIG. 7 is a cross-sectional view taken along the line A-A of FIG. 6;

FIG. 8 is a perspective view of a semiconductor device according to someembodiments of present inventive concepts;

FIG. 9 is a perspective view of a semiconductor device according to someembodiments of present inventive concepts;

FIG. 10 is a cross-sectional view taken along the line A-A of FIG. 9;

FIG. 11 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIGS. 12A and 12B are layout views of a semiconductor device accordingto some embodiments of present inventive concepts;

FIG. 13 is a cross-sectional view taken along the lines D-D, E-E and F-Fof FIG. 12A;

FIG. 14 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIG. 15 is a cross-sectional view taken along the line A-A of FIG. 14;

FIG. 16 is a cross-sectional view taken along the line B-B of FIG. 14;

FIG. 17 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIG. 18 is a cross-sectional view taken along the line A-A of FIG. 17;

FIG. 19 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIG. 20 is a cross-sectional view taken along the line A-A of FIG. 19;

FIG. 21 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIG. 22 is a cross-sectional view taken along the line A-A of FIG. 21;

FIG. 23 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIG. 24 is a cross-sectional view taken along the line A-A of FIG. 23;

FIG. 25 is a perspective view of a semiconductor device according tosome embodiments of present inventive concepts;

FIG. 26 is a cross-sectional view taken along the line A-A of FIG. 25;

FIG. 27 is a block diagram of an electronic system including thesemiconductor devices according to some embodiments of present inventiveconcepts;

FIGS. 28 and 29 illustrate examples of semiconductor systems to whichsemiconductor devices according to some embodiments of present inventiveconcepts can be applied;

FIGS. 30 to 50 illustrate intermediate process operations of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts;

FIGS. 51 to 53 illustrate intermediate process operations of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts;

FIGS. 54 to 59 illustrate intermediate process operations of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts.

FIGS. 60 to 65 illustrate intermediate process operations of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts;

FIGS. 66 to 78 illustrates an intermediate process operation of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts;

FIG. 79 illustrates an intermediate process operation of a method forfabricating a semiconductor device according to some embodiments ofpresent inventive concepts;

FIGS. 80 to 82 illustrate intermediate process operations of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts; and

FIGS. 83 to 86 illustrate intermediate process operations of a methodfor fabricating a semiconductor device according to some embodiments ofpresent inventive concepts.

DETAILED DESCRIPTION

Example embodiments are described below with reference to theaccompanying drawings. Many different forms and embodiments are possiblewithout deviating from the spirit and teachings of this disclosure andso the disclosure should not be construed as limited to the exampleembodiments set forth herein. Rather, these example embodiments areprovided so that this disclosure will be thorough and complete, and willconvey the scope of the disclosure to those skilled in the art. In thedrawings, the sizes and relative sizes of layers and regions may beexaggerated for clarity. Like reference numbers refer to like elementsthroughout the description.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the embodiments.As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes,” and/or “including,” when used in thisspecification, specify the presence of the stated features, steps,operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, steps, operations,elements, components, and/or groups thereof.

It will be understood that when an element is referred to as being“coupled,” “connected,” or “responsive” to, or “on,” another element, itcan be directly coupled, connected, or responsive to, or on, the otherelement, or intervening elements may also be present. In contrast, whenan element is referred to as being “directly coupled,” “directlyconnected,” or “directly responsive” to, or “directly on,” anotherelement, there are no intervening elements present. As used herein theterm “and/or” includes any and all combinations of one or more of theassociated listed items.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the figures. For example, if the device in thefigures is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device may be otherwise oriented (rotated 90degrees or at other orientations) and the spatially relative descriptorsused herein may be interpreted accordingly.

Example embodiments of the inventive concepts are described herein withreference to cross-sectional illustrations that are schematicillustrations of idealized embodiments (and intermediate structures) ofexample embodiments. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, example embodiments of theinventive concepts should not be construed as limited to the particularshapes of regions illustrated herein but are to include deviations inshapes that result, for example, from manufacturing. Accordingly, theregions illustrated in the figures are schematic in nature and theirshapes are not intended to illustrate the actual shape of a region of adevice and are not intended to limit the scope of example embodiments.

It will be understood that although the terms “first,” “second,” etc.may be used herein to describe various elements, these elements shouldnot be limited by these terms. These terms are only used to distinguishone element from another. Thus, a “first” element could be termed a“second” element without departing from the teachings of the presentembodiments.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this inventive concept belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

As appreciated by the present inventive entity, devices and methods offorming devices according to various embodiments described herein may beembodied in microelectronic devices such as integrated circuits, whereina plurality of devices according to various embodiments described hereinare integrated in the same microelectronic device. Accordingly, thecross-sectional view(s) illustrated herein may be replicated in twodifferent directions, which need not be orthogonal, in themicroelectronic device. Thus, a plan view of the microelectronic devicethat embodies devices according to various embodiments described hereinmay include a plurality of the devices in an array and/or in atwo-dimensional pattern that is based on the functionality of themicroelectronic device.

The devices according to various embodiments described herein may beinterspersed among other devices depending on the functionality of themicroelectronic device. Moreover, microelectronic devices according tovarious embodiments described herein may be replicated in a thirddirection that may be orthogonal to the two different directions, toprovide three-dimensional integrated circuits.

Accordingly, the cross-sectional view(s) illustrated herein providesupport for a plurality of devices according to various embodimentsdescribed herein that extend along two different directions in a planview and/or in three different directions in a perspective view. Forexample, when a single active region is illustrated in a cross-sectionalview of a device/structure, the device/structure may include a pluralityof active regions and transistor structures (or memory cell structures,gate structures, etc., as appropriate to the case) thereon, as would beillustrated by a plan view of the device/structure.

Hereinafter, a semiconductor device 1 according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 1to 4.

FIG. 1 is a perspective view of a semiconductor device 1 according tosome embodiments of present inventive concepts, FIG. 2 is across-sectional view taken along the line A-A of FIG. 1, FIG. 3 is across-sectional view taken along the line B-B of FIG. 1, and FIG. 4 is across-sectional view taken along the line C-C of FIG. 1. First andsecond interlayer insulation layers 131 and 132 may be provided in someembodiments, even if not explicitly illustrated in FIG. 1.

Referring to FIGS. 1 to 4, the semiconductor device 1 may include asubstrate 101, first to third fins F1, F2 and F3, a field insulationlayer 110, a recess 141 b, a device isolation layer 143, first andsecond gate structures 151 a and 151 b, a dummy gate structure 152, afirst spacer 115, first to third source/drain regions 121, 123 and 125,first and second interlayer insulation layers 131 and 132, a silicidelayer 161, and a contact 163.

In detail, the substrate 101 may include one or more semiconductormaterials selected from the group comprising Silicon (Si), Germanium(Ge), Silicon Germanium (SiGe), Gallium Phosphide (GaP), GalliumArsenide (GaAs), Silicon Carbide (SiC), Silicon-Germanium-Carbon(SiGeC), Indium Arsenide (InAs) and Indium Phosphide (InP). Moreover, insome embodiments, the substrate 101 may be a silicon on insulator (SOI)substrate.

The first to third fins F1 to F3 may protrude in a third direction Z1.The first to third fins F1 to F3 may extend in a lengthwise direction,that is, lengthwise in a first direction X1. Each of the first to thirdfins F1 to F3 may have long sides and short sides. The first to thirdfins F1 to F3 may be disposed on the substrate 101 to be spaced apartfrom one another. For example, the first to third fins F1 to F3 may bespaced apart from one another in the second direction Y1. In FIG. 1, thelong side direction corresponds to the first direction X1 and the shortside direction corresponds to the second direction Y1, but aspects ofpresent inventive concepts are not limited thereto. In each of the firstto third fins F1 to F3, for example, the long side direction maycorrespond to the second direction Y1 and the short side direction maycorrespond to the first direction X1.

Each of the first to third fins F1 to F3 may be part of the substrate101 or may include an epitaxial layer grown from the substrate 101. Thefirst to third fins F1 to F3 may include, for example, Si or SiGe. Thefield insulation layer 110 may be formed on the substrate 101 and mayexpose top portions of sidewalls of the first to third fins F1 to F3.The field insulation layer 110 may be, for example, an oxide layer.

The first and second gate structures 151 a and 151 b and the dummy gatestructure 152 are disposed to be spaced apart from each other. The firstand second gate structures 151 a and 151 b and the dummy gate structure152 may cross the first to third fins F1 to F3, respectively. The dummygate structure 152 is disposed on the device isolation layer 143. InFIG. 1, the first and second gate structures 151 a and 151 b and thedummy gate structure 152 extending in the second direction Y1 areillustrated, but aspects of present inventive concepts are not limitedthereto. The first and second gate structures 151 a and 151 b and thedummy gate structure 152 may cross/overlap each of the first to thirdfins F1 to F3 while forming an acute angle or an obtuse angle with thefirst to third fins F1 to F3.

The recess 141 b aligned in the second direction Y1 is formed in each ofthe first to third fins F1 to F3. A bottom surface of the recess 141 bis lower than or at the same level with bottom surfaces of the first tothird source/drain regions 121, 123 and 125. In FIG. 2, the recess 141 bis illustrated with the shape of a trench tapering away from its topportion, but aspects of present inventive concepts are not limitedthereto. The recess 141 b may have, for example, a U-shape, a V-shape, arectangular shape, or a trapezoidal shape.

The device isolation layer 143 may fill the recess 141 b. Therefore, thedevice isolation layer 143 may extend in the second direction Y1. Thedevice isolation layer 143 may be formed on the field insulation layer110 and may be formed in the first to third fins F1 to F3. Since thedevice isolation layer 143 fills the recess 141 b, a bottom surface ofthe device isolation layer 143 is lower than bottom surfaces of first tothird source/drain regions 121, 123 and 125. The device isolation layer143 may isolate source/drain regions 123 formed at opposite sides of thedevice isolation layer 143 to inhibit/prevent a short from occurring andto inhibit/prevent current from flowing. The device isolation layer 143may include, for example, an oxide layer, a nitride layer, or anoxynitride layer. The device isolation layer 143 is spaced apart fromthe first to third source/drain regions 121, 123 and 125.

Top surfaces of the first and second gate structures 151 a and 151 b maybe coplanarly positioned with a top surface of the dummy gate structure152.

The first and second gate structures 151 a and 151 b may includerespective first and second gate insulation layers 153 a and 153 b andrespective first and second gate electrodes 155 a and 155 b.

The first and second gate insulation layers 153 a and 153 b may beformed between the first to third fins F1 to F3 and the first and secondgate electrodes 155 a and 155 b, respectively. As shown in FIG. 1 andFIG. 4, the first and second gate insulation layers 153 a and 153 b maybe formed on top surfaces and top portions of sidewalls of the first tothird fins F1 to F3, respectively. In addition, the first and secondgate insulation layers 153 a and 153 b may be disposed between each ofthe first and second gate electrodes 155 a and 155 b and the fieldinsulation layer 110, respectively. The first and second gate insulationlayers 153 a and 153 b may include a high-k material having a higherdielectric constant than a silicon oxide layer. For example, the firstand second gate insulation layers 153 a and 153 b may include HafniumOxide (HfO₂), Zirconium Oxide (ZrO₂), Lanthanum Oxide (LaO), AluminumOxide (Al₂O₃) or Tantalum Oxide (Ta₂O₅).

The first and second gate electrodes 155 a and 155 b may include firstand second metal layers MG1 and MG2, respectively. As shown, the firstand second gate electrodes 155 a and 155 b may include two or morestacked metal layers MG1 and MG2. The first metal layer MG1 may controla work function, and the second metal layer MG2 may fill a spaceprovided by the first metal layer MG1. As shown in FIG. 3, the firstmetal layer MG1 may be conformally formed along the top surfaces and topportions of sidewalls of the first to third fins F1 to F3. For example,the first metal layer MG1 may include at least one of Titanium Nitride(TiN), Tantalum Nitride (TaN), Titanium Carbide (TiC), Titanium-AluminumCarbide (TiA1C) and Tantalum Carbide (TaC). In addition, the secondmetal layer MG2 may include Tungsten (W) or Aluminum (Al). In addition,the first and second gate electrodes 155 a and 155 b may include mayinclude a non-metal material, e.g., Si or SiGe. The first and secondgate structures 151 a and 151 b may be formed by, for example, areplacement process, but aspects of present inventive concepts are notlimited thereto.

The dummy gate structure 152 may include a dummy gate insulation layer153 c and a dummy gate electrode 155 c. The dummy gate structure 152does not function as a gate of a transistor, unlike the first and secondgate structures 151 a and 151 b.

As shown in FIGS. 2 and 3, the dummy gate insulation layer 153 c may beformed between each of the first to third fins F1 to F3 and the dummygate electrode 155 c. As shown in FIG. 3, the dummy gate insulationlayer 153 c may be formed on the device isolation layer 143. The dummygate insulation layer 153 c may include a high-k material having ahigher dielectric constant than a silicon oxide layer. For example, thedummy gate insulation layer 153 c may include HfO₂, ZrO₂, LaO, Al₂O₃ orTa₂O₅.

The dummy gate electrode 155 c may include first and second metal layersMG1 and MG2. As shown in FIG. 3, the dummy gate electrode 155 c mayinclude two or more stacked sub metal layers, that is, the first andsecond metal layers MG1 and MG2. For example, the first metal layer MG1may include at least one of TiN, TaN, TiC, TiAlC and TaC. In addition,the second metal layer MG2 may include W or Al. In addition, the dummygate electrode 155 c may include a non-metal material, e.g., Si or SiGe.The dummy gate structure 152 may be formed by, for example, areplacement process, but aspects of present inventive concepts are notlimited thereto.

The dummy gate structure 152 and the first and second gate structures151 a and 151 b may be formed at the same time.

The first spacer 115 may be formed on sidewalls of the first and secondgate structures 151 a and 151 b and sidewalls of the dummy gatestructure 152. The first spacer 115 is disposed on the first to thirdfins F1 to F3 but is not disposed on the recess 143. For example, thefirst spacer 115 may include at least one of an oxide layer, a nitridelayer and an oxynitride layer. Alternatively, the first spacer 115 mayinclude multiple layers, rather than a single layer.

The first to third source/drain regions 121, 123 and 125 may be disposedon both sides of the first and second gate structures 151 a and 151 band the dummy gate structure 152. In other words, the first to thirdsource/drain regions 121, 123 and 125 may be disposed between the firstgate structure 151 a and the dummy gate structure 152 and between thesecond gate structure 151 b and the dummy gate structure 152. The firstto third source/drain regions 121, 123 and 125 may be disposed in thefirst to third fins F1 to F3, respectively. Therefore, the first tothird source/drain regions 121, 123 and 125 may be formed at portionsproduced by partially etching the first to third fins F1 to F3.

In FIG. 1, the first to third source/drain regions 121, 123 and 125 areillustrated as making contact with one another, but aspects of presentinventive concepts are not limited thereto. Rather, the first to thirdsource/drain regions 121, 123 and 125 may be spaced apart from oneanother.

The first to third source/drain regions 121, 123 and 125 may be elevatedsource/drain regions. Therefore, top surfaces of the first to thirdsource/drain regions 121, 123 and 125 may be higher than top surfaces ofthe first to third fins F1 to F3.

When the semiconductor device 1 is a PMOS transistor, the first to thirdsource/drain regions 121, 123 and 125 may include a compressive stressmaterial. For example, the compressive stress material may be a materialhaving a larger lattice constant than silicon (Si), such as, forexample, SiGe. The compressive stress material may improve the mobilityof carriers of a channel region by applying compressive stress to thefirst to third fins F1 to F3 under the first and second gate structures151 a and 151 b, that is, the channel region.

When the semiconductor device 1 is an NMOS transistor, the first tothird source/drain regions 121, 123 and 125 may include the samematerial as the substrate 101 or a tensile stress material. For example,when the substrate 101 includes Si, the first to third source/drainregions 121, 123 and 125 may include Si or a material having a smallerlattice constant than Si (e.g., SiC or Silicon Phosphide (SiP)).

The first to third source/drain regions 121, 123 and 125 may be formedthrough epitaxial growth.

The silicide layer 161 is disposed on the first to third source/drainregions 121, 123 and 125. The silicide layer 161 may be formed along thetop surfaces of the first to third source/drain regions 121, 123 and125. The silicide layer 161 may serve to reduce surface resistance orcontact resistance of the first to third source/drain regions 121, 123and 125 and may include a conductive material, for example, Platinum(Pt), Nickel (Ni), or Cobalt (Co).

The contact 163 is formed on the silicide layer 161. The contact 163 maybe made of a conductive material, for example, W, Al or Copper (Cu), butis not limited thereto.

The first interlayer insulation layer 131 and the second interlayerinsulation layer 132 are sequentially formed on the field insulationlayer 110. The first interlayer insulation layer 131 may cover thesilicide layer 161 and sidewalls of the first spacer 115 and may coverportions of sidewalls of the contact 163. The second interlayerinsulation layer 132 may cover the remaining portions of the sidewallsof the contact 163.

As shown in FIG. 2, a top surface of the first interlayer insulationlayer 131 may be coplanarly positioned with the top surfaces of thefirst and second gate structures 151 a and 151 b and a top surface ofthe dummy gate structure 152. The top surface of the first interlayerinsulation layer 131, the top surfaces of the first and second gatestructures 151 a and 151 b and the top surface of the dummy gatestructure 152 may become parallel with each other through planarization(for example, Chemical Mechanical Planarization/Polishing (CMP)). Thesecond interlayer insulation layer 132 may be formed to cover the firstand second gate structures 151 a and 151 b and the dummy gate structure152. The first interlayer insulation layer 131 and the second interlayerinsulation layer 132 may include at least one of an oxide layer, anitride layer and an oxynitride layer.

Hereinafter, a semiconductor device 2 according to some embodiments ofpresent inventive concepts will be described with reference to FIG. 5.Referring to the semiconductor device 2, repeated descriptions of thesame content as that of the semiconductor device 1 may be omitted, andthe following description will focus on differences between thesemiconductor devices 1 and 2.

FIG. 5 is a perspective view of a semiconductor device 2 according tosome embodiments of present inventive concepts. The first and secondinterlayer insulation layers 131 and 132 may be provided in thesemiconductor device 2, even if they are not explicitly illustrated inFIG. 5.

Compared to the semiconductor device 1 shown in FIG. 1, thesemiconductor device 2 according to some embodiments of presentinventive concepts further includes a cover layer 169. The cover layer169 may cover top surfaces of a dummy gate structure 152 and first andsecond gate structures 151 a and 151 b. The cover layer 169 may extendin a second direction Y1. A first spacer 115 may cover sidewalls of thecover layer 169. In a case where the cover layer 169 is formed, a topsurface of the first interlayer insulation layer 131 (e.g., the firstinterlayer insulation layer 131 illustrated in FIG. 2) may be coplanarlypositioned with the top surface of the cover layer 169 and the secondinterlayer insulation layer 132 (e.g., the second interlayer insulationlayer 132 illustrated in FIG. 3) may cover the cover layer 169.

The cover layer 169 may protect the first and second gate structures 151a and 151 b and the dummy gate structure 152. For example, even if acontact 163 is misaligned, the cover layer 169 may inhibit/preventshorts between the contact 163 and the first and second gate structures151 a and 151 b and between the contact 163 and the dummy gate structure152. In addition, deterioration of the first and second gate structures151 a and 151 b may be reduced/prevented by the cover layer 169. Thecover layer 169 may include, for example, at least one of SiliconCarbonitride (SiCN), Silicon Nitride (SiN), Silicon Oxynitride (SiON),Silicon-Carbon-Oxynitride (SiCON), and Silicon Oxycarbide (SiCO).

Hereinafter, a semiconductor device 3 according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 6and 7. In the semiconductor device 3, repeated descriptions of the samecontent as that of the semiconductor device 1 may be omitted, and thefollowing description will focus on differences between thesemiconductor devices 1 and 3.

FIG. 6 is a perspective view of a semiconductor device 3 according tosome embodiments of present inventive concepts and FIG. 7 is across-sectional view taken along the line A-A of FIG. 6. The first andsecond interlayer insulation layers 131 and 132 may be provided in thesemiconductor device 3, even if they are not explicitly illustrated inFIG. 6.

The semiconductor device 3 shown in FIGS. 6 and 7 may be different fromthe semiconductor device 1 shown in FIG. 1, in view of configurations ofa device isolation layer 143, a dummy gate structure 152 and a firstspacer 115. In addition, the semiconductor device 3 further includes aninner spacer 170 and a capping layer 142, compared to the semiconductordevice 1 shown in FIG. 1.

While the first spacer 115 formed on sidewalls of first and second gatestructures 151 a and 151 b may be the same as that of the semiconductordevice 1 shown in FIG. 1, spacers 116 and 117 formed on oppositesidewalls of the dummy gate structure 152 have different structures fromeach other. In detail, the spacer 116 covering one sidewall of the dummygate structure 152 and the spacer 117 covering the other sidewall of thedummy gate structure 152 are disposed on first to third fins F1 to F3while not covering a recess 141 b.

The spacers 116 and 117 include first and second regions 116 a and 116 band third and fourth regions 117 a and 117 b, respectively. The secondregion 116 b is disposed on the first region 116 a and the fourth region117 b is disposed on the third region 117 a. A width of the first region116 a is greater than or equal to a width of the second region 116 b,and a width of the third region 117 a is greater than or equal to awidth of the fourth region 117 b. Therefore, the spacers 116 and 117 mayhave L shapes facing each other. Here, the phrase “facing each other”may mean that a distance between the first region 116 a and the thirdregion 117 a is shorter than a distance between the second region 116 band the fourth region 117 b. In a case where the spacers 116 and 117 donot face each other, the first and third regions 116 a and 117 a mayprotrude in opposite directions. Therefore, if the spacers 116 and 117do not face each other, the distance between the first region 116 a andthe third region 117 a is equal to the distance between the secondregion 116 b and the fourth region 117 b.

The inner spacer 170 is formed on inner sidewalls of the spacers 116 and117. In detail, the inner spacer 170 is formed on sidewalls of the firstregion 116 a and the third region 117 a. A height of the inner spacer170 may be equal to heights of the first and third regions 116 a and 117a. A profile of the inner spacer 170 and a profile of the recess 141 bmay be connected. The inner spacer 170 may include, for example, atleast one of an oxide layer, a nitride layer and an oxynitride layer.

The capping layer 142 may be formed between the recess 141 b and thedevice isolation layer 143. The capping layer 142 may be conformallyformed along an inner surface of the recess 141 b. In addition, thecapping layer 142 may extend to be conformally formed along thesidewalls of the spacers 116 and 117. The capping layer 142 may bedisposed between each of the spacers 116 and 117 and the dummy gatestructure 152. The capping layer 142 may include, for example, at leastone of an oxide layer, a nitride layer and an oxynitride layer.

The dummy gate structure 152 is formed on the device isolation layer142. A bottom surface of the dummy gate structure 152 may be higher thanbottom surfaces of the first and second gate structures 151 a and 151 b.In other words, a top surface of the device isolation layer 143 may behigher than or at the same level with top surfaces of the first to thirdfins F1 to F3.

When the bottom surface of the dummy gate structure 152 is higher thanthe bottom surfaces of the first and third regions 116 a and 117 a, thedevice isolation layer 143 may have fifth to seventh regions 143 a, 143b and 143 c. Here, the fifth region 143 a of the device isolation layer143 is a region filling the recess 141 b, the sixth region 143 b is aregion between the first and third regions 116 a and 117 a disposed onthe fifth region 143 a, and the seventh region 143 c is a regionextending from the sixth region 143 b to the bottom surface of the dummygate structure 152. A width of the seventh region 143 c is greater thanor equal to a width of the sixth region 143 b. Therefore, a portion ofthe first region 116 a and a portion of the third region 117 a may bedisposed between the seventh region 143 c and each of the first to thirdfins F1 to F3. In addition, the first region 116 a and the third region117 a may cover a portion of the bottom surface of the dummy gatestructure 152. In other words, the portion of the first region 116 a andthe portion of the third region 117 a may be disposed between each ofthe first to third fins F1 to F3 and the dummy gate structure 152, butaspects of present inventive concepts are not limited thereto. Thebottom surface of the dummy gate structure 152 may come into contactwith the seventh region 143 c.

Since the other parts of the semiconductor device 3 shown in FIGS. 6 and7 may be the same as those of the semiconductor device 1 shown in FIG.1, no further description may be given.

Hereinafter, a semiconductor device 4 according to some embodiments ofpresent inventive concepts will be described with reference to FIG. 8.In the semiconductor device 4, repeated descriptions of the same contentas that of the semiconductor device 3 may be omitted, and the followingdescription will focus on differences between the semiconductor devices3 and 4.

FIG. 8 is a perspective view of a semiconductor device 4 according tosome embodiments of present inventive concepts. The first and secondinterlayer insulation layers 131 and 132 may be provided in thesemiconductor device 4, even if they are not explicitly illustrated inFIG. 8.

Compared to the semiconductor device 3 shown in FIG. 6, thesemiconductor device 4 according to some embodiments of presentinventive concepts further includes a cover layer 169. The cover layer169 may cover top surfaces of a dummy gate structure 152 and first andsecond gate structures 151 a and 151 b. A spacer 115 may cover sidewallsof the cover layer 169. In addition, a capping layer 142 may be disposedbetween the dummy gate structure 152 and each of spacers 116 and 117disposed at opposite sides of the dummy gate structure 152, whilecovering sidewalls of the dummy gate structure 152. When the cover layer169 is formed, a top surface of the first interlayer insulation layer131 may be coplanarly positioned with a top surface of the cover layer169, and the second interlayer insulation layer 132 may cover the coverlayer 169.

The cover layer 169 may protect the first and second gate structures 151a and 151 b and the dummy gate structure 152. The cover layer 169 mayinclude, for example, at least one of SiCN, SiN, SiON, SiCON, and SiCO.

Hereinafter, a semiconductor device 5 according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 9and 10. In the semiconductor device 5, repeated descriptions of the samecontent as that of the semiconductor device 1 may be omitted, and thefollowing description will focus on differences between thesemiconductor devices 1 and 5.

FIG. 9 is a perspective view of a semiconductor device 5 according tosome embodiments of present inventive concepts and FIG. 10 is across-sectional view taken along the line A-A of FIG. 9.

Unlike the semiconductor device 1 shown in FIG. 1, the semiconductordevice 5 according to some embodiments of present inventive concepts isnot provided with a device isolation layer 143. Instead, a dummy gatestructure 152 fills a recess 141 b.

In detail, the dummy gate structure 152 may fill the recess 141 b, and atop surface of the dummy gate structure 152 may be coplanarly positionedwith top surfaces of first and second gate structures 151 d and 151 e.

The first and second gate structures 151 d and 151 e may include firstand second gate insulation layers 153 a and 153 b, a barrier layer 154,and first and second gate electrodes 155 a and 155 b, respectively. Thefirst and second gate insulation layers 153 a and 153 b may cover topsurfaces and top portions of sidewalls of first to third fins F1 to F3and may be conformally formed along sidewalls of the spacer 115 and thesidewalls of the first to third fins F1 to F3, as shown in FIG. 10.However, unlike in the semiconductor device 1 shown in FIG. 1, the firstand second gate insulation layers 153 a and 153 b of FIGS. 9 and 10 donot cover the whole portions of the sidewalls of the spacer 115 butcover only portions of the sidewalls of the spacer 115.

The barrier layer 154 is disposed on each of the first and second gateinsulation layers 153 a and 153 b. The barrier layer 154 may have aconcave shape, like the first and second gate insulation layers 153 aand 153 b. The barrier layer 154 may include, for example, TitaniumNitride (TiN), but is not limited thereto.

The first and second gate electrodes 155 a and 155 b cover the first andsecond gate insulation layers 153 a and 153 b and barrier layers 154,respectively. The first and second gate electrodes 155 a and 155 b mayinclude first and second metal layers MG1 and MG2.

The dummy gate structure 152 may include the dummy gate insulation layer153 c, the barrier layer 154, and the dummy gate electrode 155 c, andthe dummy gate electrode 155 c may include first and second metal layersMG1 and MG2.

The dummy gate insulation layer 153 c is disposed on the sidewalls ofthe spacer 115 but is not disposed in the recess 141 b. The dummy gateinsulation layer 153 c may have an L shape. The barrier layer 154 isdisposed on the dummy gate insulation layer 153 c but is not disposed onthe recess 141 b. A width of the recess 141 b is wider than a width ofthe first spacer 115.

The dummy gate electrode 155 c fills the recess 141 b and is formed onthe recess 141 b. For example, the recess 141 b may be filled with thefirst metal layer MG1, and the second metal layer MG2 may be formed onthe first metal layer MG1.

Hereinafter, a semiconductor device 6 according to some embodiments ofpresent inventive concepts will be described with reference to FIG. 11.In the semiconductor device 6, repeated descriptions of the same contentas that of the semiconductor device 5 may be omitted, and the followingdescription will focus on differences between the semiconductor devices5 and 6.

FIG. 11 is a perspective view of a semiconductor device 6 according tosome embodiments of present inventive concepts. The first and secondinterlayer insulation layers 131 and 132 may be provided in thesemiconductor device 6, even if they are not explicitly illustrated inFIG. 11.

Compared to the semiconductor device 5 shown in FIG. 9, thesemiconductor device 6 according to some embodiments of presentinventive concepts further includes a cover layer 169. The cover layer169 may cover top surfaces of a dummy gate structure 152 and first andsecond gate structures 151 a and 151 b. A spacer 115 may cover sidewallsof the cover layer 169. When the cover layer 169 is formed, a topsurface of the first interlayer insulation layer 131 may be coplanarlypositioned with a top surface of the cover layer 169, and the secondinterlayer insulation layer 132 may cover the cover layer 169.

Hereinafter, a semiconductor device 7 according to some embodiments ofpresent inventive concepts will be described with reference to FIGS.12A, 12B and 13. In the semiconductor device 7, repeated descriptions ofthe same content as described above may be omitted, and the followingdescription will focus on differences.

FIGS. 12A and 12B are layout views of a semiconductor device 7 accordingto some embodiments of present inventive concepts and FIG. 13 is across-sectional view taken along the lines D-D, E-E and F-F of FIG. 12A.In FIG. 12A, only first to third fins F1 to F3, first and second gatestructures 151 a and 151 b and a dummy gate structure 152 areillustrated. In FIG. 12B, spacers 115-117 and an inner spacer 170,rather than first and second gate structures 151 a and 151 b and a dummygate structure 152, are illustrated in a first region I shown in FIG.12A. In FIG. 13, only a second fin F2, a third fin F3, a sixth fin F21,a seventh fin F22 and a substrate 101 are illustrated.

Referring to FIGS. 12A, 12B and 13, a first region I and a second regionII are defined on the substrate 101. The first region I and the secondregion II may be spaced apart from each other or may be connected toeach other. The first region I may be the same as that of each of theaforementioned semiconductor devices 1 to 6. Therefore, the first tothird fins F1 to F3 may extend in a direction X1 while protruding fromthe substrate 101. A recess 141 b may be formed in each of the first tothird fins F1 to F3. The recess 141 b may extend in a second directionY1. The dummy gate structure 152 may be disposed on the recess 141 b andmay extend in the second direction Y1. In addition, the first spacer 115and the inner spacer 170 may extend in the second direction Y1 atopposite sides of the dummy gate structure 152. The inner spacer 170 mayextend in the second direction Y1 between the first spacer 115 and thedummy gate structure 152. At opposite sides of the first and second gatestructures 151 a and 151 b, only the first spacer 115 extends in thesecond direction Y1 but the inner spacer 170 is not formed.

In the second region II, fourth to ninth fins F11, F12, F21, F22, F31and F32 may protrude from the substrate 101. The fourth and fifth finsF11 and F12 may be aligned and extend in the first direction X1 and maybe spaced apart from one another by a trench 241 b. The sixth andseventh fins F21 and F22 may be aligned and extend in the firstdirection X1 and may be spaced apart from one another by the trench 241b. The eighth and ninth fins F31 and F32 may be aligned and extend inthe first direction X1 and may be spaced apart from one another by thetrench 241 b. The fourth, sixth and eighth fins F11, F21 and F31 arespaced apart from one another in the second direction Y1, and the fifth,seventh and ninth fins F12, F22 and F32 are spaced apart from oneanother in the second direction Y1. The trench 241 b may extend in thesecond direction Y1.

A height L1 of the recess 141 b is smaller than a height L2 of thetrench 241 b, and a width W1 of the recess 141 b is smaller than a widthW2 of the trench 241 b. A height L3 of a shallow trench isolation (STI)region between fins, for example, between the second fin F2 and thethird fin F3 is greater than the height L1 of the recess 141 b andsmaller than the height L2 of the trench 241 b. The trench 241 b may beformed by etching a portion of the substrate 101. The height L3 of theSTI region may be equal to heights of the second fin F2 and the thirdfin F3.

In other words, among the height L1 of the recess 141 b, the height L3of the STI region and the height L2 of the trench 241 b, the height L1of the recess 141 b is smallest and the height L2 of the trench 241 b islargest.

The recess 141 b may be filled with a first device isolation layer (143of FIGS. 1 to 8) and the trench 241 b may be filled with a second deviceisolation layer. In addition, in the first region I, like in thesemiconductor devices 2 to 4, a capping layer 142 may be conformallyformed along an inner surface of the recess 141 b. However, the cappinglayer 142 is not formed in the trench 241 b of the second region II. Thesecond device isolation layer may include the same material as the firstdevice isolation layer (143 of FIGS. 1 to 8).

The first region I and the second region II may be defined according tothe arrangement and operation of a semiconductor device. For example,the first region I may be a memory region and the second region II maybe a core/periphery region.

Alternatively, the first region I may be a Static Random Access Memory(SRAM) region and the second region II may be a logic region, butaspects of present inventive concepts are not limited thereto. That isto say, the second region II may be a logic region and the first regionI may be a region in which other types of memories, for example, DynamicRandom Access Memory (DRAM), Magnetic/Magnetoresistive Random AccessMemory (MRAM), Resistive Random Access Memory (RRAM), Phase-ChangeRandom Access Memory (PRAM), etc., are formed.

Next, a semiconductor device 8 according to some embodiments of presentinventive concepts will be described with reference to FIGS. 14 to 16.In the semiconductor device 8, repeated descriptions of the same contentas described above may be omitted, and the following description willfocus on differences.

FIG. 14 is a perspective view of a semiconductor device 8 according tosome embodiments of present inventive concepts, FIG. 15 is across-sectional view taken along the line A-A of FIG. 14, and FIG. 16 isa cross-sectional view taken along the line B-B of FIG. 14. The firstand second interlayer insulation layers 131 and 132 may be provided inthe semiconductor device 8, even if they are not explicitly illustratedin FIG. 14.

Unlike in the semiconductor device 1 shown in FIG. 1, in thesemiconductor device 8 shown in FIG. 14, a dummy gate structure 152 isnot formed. Instead, a device isolation layer 175 may fill a region thatmight otherwise be filled with the dummy gate structure 152.

In detail, referring to FIG. 15, a recess 141 b is formed in each offirst to third fins F1 to F3. The device isolation layer 175 may fillthe recess 141 b. A spacer 115 may be disposed on sidewalls of thedevice isolation layer 175 protruding from the recess 141 b. The spacer115 is disposed on the first to third fins F1 to F3 but is not formed onthe recess 141 b.

The device isolation layer 175 may include, for example, at least one ofsilicon oxide, silicon nitride, silicon oxynitride, hafnium oxide,lanthanum oxide, polysilicon, germanium, germanium oxide, titaniumoxide, and tungsten oxide.

A capping layer 173 may be formed between the recess 141 b and thedevice isolation layer 175. The capping layer 173 may be conformallyformed along sidewalls of a first spacer 115, top surfaces of the firstto third fins F1 to F3, and an inner surface of the recess 141 b. Thecapping layer 173 may be disposed on the first to third fins F1 to F3and a field insulation layer 110.

The capping layer 173 may include, for example, at least one of siliconoxide, silicon nitride, silicon oxynitride, Hf oxide, La oxide,polysilicon, Ge, Ge oxide, Ti oxide, and W oxide.

Meanwhile, a second capping layer (e.g., the second capping layer 174illustrated in FIG. 19) may be additionally formed between the cappinglayer 173 and the device isolation layer 175. The second capping layer174 is described in greater detail with respect to FIG. 19.

A profile of the first spacer 115 and a profile of the recess 141 b arenot connected.

The device isolation layer 175 may include a first region 175 a in therecess 141 b and a second region 175 b on the recess 141 b, and a widthof the first region 175 a may be smaller than a width of the secondregion 175 b. A top surface of the device isolation layer 175 and topsurfaces of the first and second gate structures 151 a and 151 b may becoplanarly positioned with each other.

Hereinafter, a semiconductor device 9 a according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 17and 18. In the semiconductor device 9 a, repeated descriptions of thesame content as described above may be omitted, and the followingdescription will focus on differences.

FIG. 17 is a perspective view of a semiconductor device 9 a according tosome embodiments of present inventive concepts and FIG. 18 is across-sectional view taken along the line A-A of FIG. 17. The first andsecond interlayer insulation layers 131 and 132 may be provided in thesemiconductor device 9 a, even if they are not explicitly illustrated inFIG. 17.

Referring to FIGS. 17 and 18, compared to the semiconductor device 8shown in FIG. 14, the semiconductor device 9 a shown in FIG. 17 furtherincludes an inner spacer 170. The inner spacer 170 may be disposedbetween a device isolation layer 175 and a first spacer 115. In detail,the inner spacer 170 is formed on sidewalls of the first spacer 115. Aprofile of the inner spacer 170 and a profile of a recess 141 b areconnected. A capping layer 173 may be conformally formed along innersurfaces of the inner spacer 170 and the recess 141 b, and the deviceisolation layer 175 may be formed on the capping layer 173. A topsurface of the device isolation layer 175 and top surfaces of the firstand second gate structures 151 a and 151 b may be coplanarly positionedwith each other. The first spacer 115 and the inner spacer 170 may havethe same height.

Hereinafter, a semiconductor device 9 b according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 19and 20. In the semiconductor device 9 b, repeated descriptions of thesame content as described above may be omitted, and the followingdescription will focus on differences.

FIG. 19 is a perspective view of a semiconductor device 9 b according tosome embodiments of present inventive concepts and FIG. 20 is across-sectional view taken along the line A-A of FIG. 19. The first andsecond interlayer insulation layers 131 and 132 may be provided in thesemiconductor device 9 b, even if they are not explicitly illustrated inFIG. 19.

Compared to the semiconductor device 9 a shown in FIG. 17, thesemiconductor device 9 b according to FIGS. 19 and 20 further includes asecond capping layer 174. The second capping layer 174 is formed betweena first capping layer 173 and a device isolation layer 175 and may beconformally formed along inner surfaces of an inner spacer 170 and arecess 141 b.

The second capping layer 174 may include, for example, at least one ofsilicon oxide, silicon nitride, silicon oxynitride, Hf oxide, La oxide,polysilicon, Ge, Ge oxide, Ti oxide, and W oxide.

Hereinafter, a semiconductor device 9 c according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 21and 22. In the semiconductor device 9 c, repeated descriptions of thesame content as described above may be omitted, and the followingdescription will focus on differences.

FIG. 21 is a perspective view of a semiconductor device 9 c according tosome embodiments of present inventive concepts and FIG. 22 is across-sectional view taken along the line A-A of FIG. 21. The first andsecond interlayer insulation layers 131 and 132 may be provided in thesemiconductor device 9 c, even if they are not explicitly illustrated inFIG. 21.

Unlike in the semiconductor device 9 a shown in FIG. 17, thesemiconductor device 9 c according to FIGS. 21 and 22 is not providedwith a capping layer 173. A device isolation layer 175 may directly filla recess 141 b.

A top surface of the device isolation layer 175 and top surfaces offirst and second gate structures 151 a and 151 b may be coplanarlypositioned with each other.

Hereinafter, a semiconductor device 10 according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 23and 24. In the semiconductor device 10, repeated descriptions of thesame content as described above may be omitted, and the followingdescription will focus on differences.

FIG. 23 is a perspective view of a semiconductor device 10 according tosome embodiments of present inventive concepts and FIG. 24 is across-sectional view taken along the line A-A of FIG. 23. The first andsecond interlayer insulation layers 131 and 132 may be provided in thesemiconductor device 10, even if they are not explicitly illustrated inFIG. 23.

Compared to the semiconductor device 3 shown in FIG. 6, thesemiconductor device 10 shown in FIG. 23 is shaped such that the dummygate structure 152 is removed/omitted. In FIG. 23, an inner spacer 170and a capping layer 173 correspond to the inner spacer 170 and thecapping layer 142 shown in FIG. 6, respectively. Moreover, in FIG. 23, aregion that might otherwise include the dummy gate structure 152 isfilled by the device isolation layer 175. Therefore, in FIGS. 23 and 24,a top surface of the device isolation layer 175 and top surfaces offirst and second gate structures 151 a and 151 b are coplanarlypositioned with each other.

Spacers 116 and 117 disposed at opposite sides of the device isolationlayer 175 and the inner spacer 170 shown in FIGS. 23 and 24 are the sameas the spacers 116 and 117 disposed at opposite sides of the dummy gatestructure 152 and the inner spacer 170 shown in FIGS. 6 and 7,respectively. Therefore, a height of the inner spacer 170 may be smallerthan a height of the spacer 116, the spacer 116 may have an L shape, topand bottom widths of the spacer 116 disposed on the sidewall of thedevice isolation layer 175 may be different from each other, and top andbottom widths of the device isolation layer 175 positioned on a recess141 b may also be different from each other, which have been describedabove in detail and detailed descriptions thereof will not be given.

Hereinafter, a semiconductor device 11 according to some embodiments ofpresent inventive concepts will be described with reference to FIGS. 25and 26. In the semiconductor device 11, repeated descriptions of thesame content as described above may be omitted, and the followingdescription will focus on differences.

FIG. 25 is a perspective view of a semiconductor device 11 according tosome embodiments of present inventive concepts and FIG. 26 is across-sectional view taken along the line A-A of FIG. 25. The first andsecond interlayer insulation layers 131 and 132 may be provided in thesemiconductor device 11, even if they are not explicitly illustrated inFIG. 25.

Unlike in the semiconductor device 10 shown in FIG. 23, in thesemiconductor device 11 according to some embodiments of presentinventive concepts, a device isolation layer 175 may cover top surfacesof spacers 116 and 117 disposed on opposite sidewalls of the deviceisolation layer 175. Therefore, heights of the spacers 116 and 117disposed on opposite sidewalls of the device isolation layer 175 aresmaller than a height of a first spacer 115 disposed on oppositesidewalls of first and second gate structures 151 a and 151 b.

The device isolation layer 175 may include first to third regions 175 a,175 b and 175 c on a recess 141 b. The first region 175 a is disposedbetween opposing portions of the inner spacer 170, the second region 175b is disposed on the first region 175 a, and the third region 175 c isdisposed on the second region 175 b. A width of the third region 175 cmay be greater than a width of the second region 175 b and the width ofthe second region 175 b may be greater than a width of the first region175 a.

A capping layer 173 may be formed along sidewalls of the firstinterlayer insulation layer 131, a top surface and sidewalls of thespacers 116 and 117, a top surface and sidewalls of the inner spacer 170and sidewalls of the recess 141 b. The capping layer 173 may have astepped shape.

Meanwhile, the capping layer 173 and the device isolation layer 175 mayextend in a first direction X1 on the spacers 116 and 117 to makecontact with a contact 163. Even if the capping layer 173 and the deviceisolation layer 175 make contact with the contact 163, the semiconductordevice 11 may not be affected by the capping layer 173 and the deviceisolation layer 175, which are not conductors and/or semiconductors.

Meanwhile, a void may be formed in the recess 141 b of each of thesemiconductor devices 1 to 11 according to some embodiments of presentinventive concepts. Alternatively, a void may be formed in each of thedevice isolation layers 143 and 175 shown in FIGS. 1 to 26. Even in acase where the void is formed, the operation of each of thesemiconductor devices 1 to 11 may not be affected by the void.

FIG. 27 is a block diagram of an electronic system including thesemiconductor devices 1 to 11 according to some embodiments of presentinventive concepts.

Referring to FIG. 27, the electronic system 1100 may include acontroller 1110, an input/output device (I/O) 1120, a memory device1130, an interface 1140 and a bus 1150. The controller 1110, the I/O1120, the memory device 1130, and/or the interface 1140 may be connectedto each other through the bus 1150. The bus 1150 corresponds to a paththrough which data moves.

The controller 1110 may include at least one of a microprocessor, adigital signal processor, a microcontroller, and logic elements capableof functions similar to those of these elements. The I/O 1120 mayinclude at least one of a keypad, a keyboard, a display device, and soon. The memory device 1130 may store data and/or commands. The interface1140 may perform functions of transmitting data to a communicationnetwork or receiving data from the communication network. The interface1140 may be wired or wireless. For example, the interface 1140 mayinclude an antenna or a wired/wireless transceiver, and so on. Theelectronic system 1100 may further include high-speed DRAM and/or SRAMas a working memory for improving the operation of the controller 1110.The semiconductor devices 1 to 11 according to some embodiments ofpresent inventive concepts may be provided in the memory device 1130 ormay be provided as some components of the controller 1110 or the I/O1120.

The electronic system 1100 may be applied to a personal digitalassistant (PDA), a portable computer, a web tablet, a wireless phone, amobile phone, a digital music player, a memory card, or any type ofelectronic device capable of transmitting and/or receiving informationin a wireless environment.

FIGS. 28 and 29 illustrate examples of semiconductor systems to whichsemiconductor devices according to some embodiments of present inventiveconcepts can be applied. FIG. 28 illustrates an example in which each ofthe semiconductor devices 1 to 11 according to some embodiments ofpresent inventive concepts is applied to a tablet computer (e.g., atablet personal computer (PC) or another tablet computer), and FIG. 29illustrates an example in which each of the semiconductor devices 1 to11 according to some embodiments of present inventive concepts isapplied to a notebook/laptop computer. At least one of the semiconductordevices 1 to 11 according to some embodiments of present inventiveconcepts can be employed to a tablet computer, a notebook/laptopcomputer, and the like. The present inventive entity appreciates thatthe semiconductor devices 1 to 11 according to some embodiments ofpresent inventive concepts may also be applied to other integratedcircuit (IC) devices, even if they are not explicitly illustratedherein.

Hereinafter, a method for fabricating a semiconductor device accordingto some embodiments of present inventive concepts will be described withreference to FIGS. 1 to 4 and 30 to 50. Repeated descriptions of thesame content as described above may be omitted, and the followingdescription will focus on differences.

FIGS. 30 to 50 illustrate intermediate process operations of a methodfor fabricating a semiconductor device 1 according to some embodimentsof present inventive concepts. In detail, FIGS. 30, 31, 32, 35, 36 and38 are perspective views of the semiconductor device 1 according to someembodiments of present inventive concepts, FIGS. 33, 37 and 39 to 50 arecross-sectional views taken along the line A-A of FIGS. 32, 36, and 38,FIG. 34 is a cross-sectional view taken along the line B-B of FIG. 32and FIGS. 45A to 45F are cross-sectional views illustrating variousshapes of a second recess (141 b).

Referring to FIG. 30, first to third fins F1 to F3 are formed on asubstrate 101. The first to third fins F1 to F3 are formed on thesubstrate 101 while protruding in a third direction Z1. The first tothird fins F1 to F3 may extend in a lengthwise direction, that is, in afirst direction X1, and may have long sides of the first direction X1and short sides of a second direction Y1, but aspects of presentinventive concepts are not limited thereto. For example, the long sidedirection may correspond to the second direction Y1 and the short sidedirection may correspond to a first direction X1.

The first to third fins F1 to F3 may be disposed to be spaced apart fromone another in the short side direction, as shown in FIG. 30.

Each of the first to third fins F1 to F3 may be part of the substrate101 or may include an epitaxial layer grown from the substrate 101. Eachof the first to third fins F1 to F3 may include, for example, Si orSiGe.

Referring to FIG. 31, an insulation layer 110 a is formed to coversidewalls of the first to third fins F1 to F3. The insulation layer 110a may include at least one of a silicon oxide layer, a silicon nitridelayer, and a silicon oxynitride layer.

Referring to FIGS. 32 to 34, a field insulation layer 110 is formed byrecessing a top portion of the insulation layer 110 a and top portionsof the first to third fins F1 to F3 are exposed. The recessing mayinclude selective etching.

Meanwhile, portions of the first to third fins F1 to F3 protruding abovethe field insulation layer 110 may be formed by an epitaxial process.For example, after forming the insulation layer 110 a, the portions ofthe first to third fins F1 to F3 may be formed by an epitaxial processusing top surfaces of the first to third fins F1 to F3 exposed by theinsulation layer 110 a as seeds without recessing.

In addition, doping, for adjusting a threshold voltage, may be performedon the exposed first to third fins F1 to F3. For example, in a case offorming an NMOS transistor, a doped impurity may be boron (B), and in acase of forming a PMOS transistor, a doped impurity may be phosphorus(P) or arsenic (As).

Next, first to third sacrificial gate structures 111 a, 111 b and 111 ccrossing the first to third fins F1 to F3 are formed on the first tothird fins F1 to F3. The first to third sacrificial gate structures 111a, 111 b and 111 c are spaced apart from one another. In FIG. 32, thefirst to third sacrificial gate structures 111 a, 111 b and 111 c areillustrated as being arranged to form a right angle with a firstdirection X1, to cross the fin F1, but aspects of present inventiveconcepts are not limited thereto. The first to third sacrificial gatestructures 111 a, 111 b and 111 c may cross the first to third fins F1to F3 with an acute angle and/or an obtuse angle formed with a seconddirection Y1.

First to third sacrificial gate structures 111 a, 111 b and 111 c may beformed on top surfaces and top portions of sidewalls of the first tothird fins F1 to F3. In addition, the first to third sacrificial gatestructures 111 a, 111 b and 111 c may be disposed on the fieldinsulation layer 110. The first to third sacrificial gate structures 111a, 111 b and 111 c may include, for example, a silicon oxide layer.

The first to third hard mask layers 113 a, 113 b and 113 c may be formedon the first to third sacrificial gate structures 111 a, 111 b and 111c, respectively. The first to third hard mask layers 113 a, 113 b and113 c may include at least one of a silicon oxide layer, a siliconnitride layer and a silicon oxynitride layer.

Next, a first spacer 115 is formed on opposite sidewalls of the first tothird sacrificial gate structures 111 a, 111 b and 111 c. The firstspacer 115 may expose top surfaces of the first to third hard masklayers 113 a, 113 b and 113 c. The first spacer 115 may include at leastone of a silicon nitride layer and a silicon oxynitride layer.

Referring to FIG. 35, the first to third fins F1 to F3 are etched. Forexample, portions of the first to third fins F1 to F3, except forportions covered by the first to third sacrificial gate structures 111a, 111 b and 111 c, may be etched. In other words, portions of the firstto third fins F1 to F3 that are exposed between each of the first tothird sacrificial gate structures 111 a, 111 b and 111 c may be etched.The first to third fins F1 to F3 may be etched using the first spacer115 and the first to third hard mask layers 113 a, 113 b and 113 c asetch masks.

Referring to FIGS. 36 and 37, first to third source/drain regions 121,123 and 125 are formed at etched portions of the first to third fins F1to F3. The first source/drain region 121 may be formed in the first finF1, the second source/drain region 123 may be formed in the second finF2, and the third source/drain region 125 may be formed in the third finF3. The first to third source/drain regions 121, 123 and 125 may beelevated source/drain regions. Therefore, top surfaces of the first tothird source/drain regions 121, 123 and 125 may be higher than the topsurfaces of the first to third fins F1 to F3.

When the semiconductor device 1 is a PMOS transistor, the first to thirdsource/drain regions 121, 123 and 125 may include a compressive stressmaterial. For example, the compressive stress material may be a materialhaving a larger lattice constant than silicon (Si), for example, SiGe.The compressive stress material may improve the mobility of carriers ofa channel region by applying compressive stress to the first to thirdfins F1 to F3 under the first and second gate structures 151 a and 151b, that is, the channel region.

When the semiconductor device 1 is an NMOS transistor, the first tothird source/drain regions 121, 123 and 125 may include the samematerial as the substrate 101 or a tensile stress material. For example,when the substrate 101 includes Si, the first to third source/drainregions 121, 123 and 125 may include Si or a material having a smallerlattice constant than Si (e.g., SiC or SiP).

Moreover, the present inventive entity appreciates that the first tothird source/drain regions 121, 123 and 125 may be formed throughepitaxial growth.

Meanwhile, although the first to third source/drain regions 121, 123 and125 are illustrated in FIG. 36 as contacting each another, aspects ofpresent inventive concepts are not limited thereto. Accordingly, in someembodiments, the first to third source/drain regions 121, 123 and 125may be spaced apart from one another (e.g., spaced apart in thedirection Y1).

Referring to FIGS. 38 and 39, a first interlayer insulation layer 131covering the first to third source/drain regions 121, 123 and 125 isformed. The first interlayer insulation layer 131 may cover sidewalls ofthe first spacer 115, and may expose the top surfaces of the first tothird hard mask layers 113 a, 113 b and 113 c. The first interlayerinsulation layer 131 may include, for example, an oxide layer.

Referring to FIG. 40, the first to third hard mask layers 113 a, 113 band 113 c are removed. To remove the first to third hard mask layers 113a, 113 b and 113 c, a planarization process (e.g., CMP) may beperformed. When the planarization process is performed, a portion of thefirst interlayer insulation layer 131 may be etched.

Residues produced by the planarization process may be removed byperforming a cleaning process after performing the planarizationprocess. At this time, the portion of the first interlayer insulationlayer 131 may be removed, so that a top surface of the first interlayerinsulation layer 131 may become lower than the top surfaces of the firstto third sacrificial gate structures 111 a, 111 b and 111 c, but aspectsof present inventive concepts are not limited thereto. For example, thetop surface of the first interlayer insulation layer 131 and the topsurfaces of the first to third sacrificial gate structures 111 a, 111 band 111 c may be coplanarly positioned with each other.

Referring to FIG. 41, a protection layer 133 covering top surfaces ofthe first interlayer insulation layer 131 and the first to thirdsacrificial gate structures 111 a, 111 b and 111 c is formed. In asubsequent process, the protection layer 133 may protect/prevent thefirst interlayer insulation layer 131 from being etched. The protectionlayer 133 may include, for example, at least one of a nitride layer, anoxynitride layer, and so on.

Referring to FIG. 42, an insulation layer 135 is formed on theprotection layer 133. The insulation layer 135 is formed for the purposeof offsetting a step difference generated while the protection layer 133is formed. In detail, since there is a height difference between the topsurface of the first interlayer insulation layer 131 and the topsurfaces of the first to third sacrificial gate structures 111 a, 111 band 111 c, the protection layer 133 may become non-planar when theprotection layer 133 is formed and a recessed portion thereof is createdon the first interlayer insulation layer 131. The insulation layer 135may make a top surface of the resultant product of FIG. 42 planar byfilling the recessed portion of the protection layer 133. The insulationlayer 135 does not entirely cover the protection layer 133 but exposes aportion of the protection layer 133. The insulation layer 135 mayinclude the same material as the first interlayer insulation layer 131.

Referring to FIG. 43, an etch mask pattern 137 is formed on theprotection layer 133. The etch mask pattern 137 exposes a top portion ofthe second sacrificial gate structure 111 b (or exposes a top portion ofthe protection layer 133 overlying the second sacrificial gate structure111 b) and covers the first and third sacrificial gate structures 111 aand 111 c.

Referring to FIG. 44, the second sacrificial gate structure 111 b isremoved and a first recess 141 a and a second recess 141 b are formed.Portions of the protection layer 133 that were formed on the secondsacrificial gate structure 111 b are first removed using the etch maskpattern 137 and the second sacrificial gate structure 111 b is thenremoved to form the first recess 141 a. The first to third fins F1 to F3are exposed by the first recess 141 a and the exposed portions areetched/removed to form the second recess 141 b.

The second recess 141 b may be spaced apart from the first to thirdsource/drain regions 121, 123 and 125. A bottom surface of the secondrecess 141 b is lower than or at the same levels as bottom surfaces ofthe first to third source/drain regions 121, 123 and 125.

In FIG. 44, the second recess 141 b is illustrated as having the shapeof a trench tapering away from its top portion, but aspects of presentinventive concepts are not limited thereto. The second recess 141 b mayhave various shapes, as shown in FIGS. 45A to 45F. For example, thesecond recess 141 b may have a V shape, as shown in FIG. 45A (recess 141ba), a rectangular shape, as shown in FIG. 45B (recess 141 bb), atrapezoidal shape, as shown in FIG. 45C (recess 141 bc), an angled Ushape, as shown in FIG. 45D (recess 141 bd), a U shape, as shown in FIG.45E (recess 141 be), or an oval shape, as shown in FIG. 45F (recess 141bf), but aspects of present inventive concepts are not limited thereto.The second recess 141 b may have a shape other than those shown in FIGS.44, 45A to 45F.

Referring to FIG. 46, the etch mask pattern 137 is removed, and a deviceisolation layer 143 a filling the first and second recesses 141 a and141 b is formed. The device isolation layer 143 a may include, forexample, an oxide layer, a nitride layer, or an oxynitride layer.

Referring to FIG. 47, the device isolation layer 143 a ispatterned/removed to expose the top surfaces of the first and thirdsacrificial gate structures 111 a and 111 c. Here, the protection layer133 covering the first and third sacrificial gate structures 111 a and111 c and the insulation layer 135 are removed together through aplanarization process. The protection layer 133 may remain only on thefirst interlayer insulation layer 131. A remaining device isolationlayer 143 may be located only in the first recess 141 a and the secondrecess 141 b.

Referring to FIG. 48, the first and third sacrificial gate structures111 a and 111 c are removed. When the first and third sacrificial gatestructures 111 a and 111 c are removed, a portion of the deviceisolation layer 143 may also be etched.

In FIG. 48, the device isolation layer 143 is illustrated as beingcoplanarly positioned with the top surfaces of the first to third finsF1 to F3, but aspects of present inventive concepts are not limitedthereto. The top surface of the device isolation layer 143 may be higherthan or at the same level as the top surfaces of the first to third finsF1 to F3.

Referring to FIG. 49, the first and second gate structures 151 a and 151b are formed at portions resulting from the removing of the first andthird sacrificial gate structures 111 a and 111 c, and a dummy gatestructure 152 is formed on the device isolation layer 143. The first andsecond gate structures 151 a and 151 b and the dummy gate structure 152may be simultaneously formed.

The first and second gate structures 151 a and 151 b may includerespective first and second gate insulation layers 153 a and 153 b andrespective first and second gate electrodes 155 a and 155 b. The firstand second gate insulation layers 153 a and 153 b may be formed betweeneach of the first to third fins F1 to F3 and each of the first andsecond gate electrodes 155 a and 155 b, respectively. The first andsecond gate insulation layers 153 a and 153 b may be formed along thetop surfaces of the first to third fins F1 to F3 and the sidewalls ofthe first spacer 115. The first and second gate insulation layers 153 aand 153 b may include a high-k material having a higher dielectricconstant than a silicon oxide layer. For example, the first and secondgate insulation layers 153 a and 153 b may include HfO₂, ZrO₂, LaO,Al₂O₃ or Ta₂O₅.

The first and second gate electrodes 155 a and 155 b may each includefirst and second metal layers MG1 and MG2. As shown in FIG. 49, thefirst and second gate electrodes 155 a and 155 b may include two or morestacked metal layers MG1 and MG2. The first metal layer MG1 may controla work function, and the second metal layer MG2 may fill a spaceprovided by the first metal layer MG1. The first metal layer MG1 may beformed along the top surfaces of the first to third fins F1 to F3 andthe sidewalls of the first spacer 115. For example, the first metallayer MG1 may include at least one of TiN, TaN, TiC, TiAlC and TaC. Inaddition, the second metal layer MG2 may include W or Al. In someembodiments, the first and second gate electrodes 155 a and 155 b mayinclude a non-metal material, e.g., Si or SiGe.

The dummy gate structure 152 may include a dummy gate insulation layer153 c and a dummy gate electrode 155 c. Unlike the first and second gatestructures 151 a and 151 b, the dummy gate structure 152 does notfunction as a gate of a transistor.

The dummy gate insulation layer 153 c may be formed between each of thefirst to third fins F1 to F3 and the dummy gate electrode 155 c. Thedummy gate insulation layer 153 c may be formed along the top surface ofthe device isolation layer 143 and the sidewalls of the first spacer115. The dummy gate insulation layer 153 c may include a high-k materialhaving a higher dielectric constant than a silicon oxide layer. Forexample, the dummy gate insulation layer 153 c may include HfO₂, ZrO₂,LaO, Al₂O₃ or Ta₂O₅.

The dummy gate electrode 155 c may include first and second metal layersMG1 and MG2. In some embodiments, the dummy gate electrode 155 c mayinclude two or more sequentially stacked metal layers MG1 and MG2. Forexample, the first metal layer MG1 may include at least one of TiN, TaN,TiC, TiAlC and TaC. In addition, the second metal layer MG2 may includeW or Al. In some embodiments, the dummy gate electrode 155 c may includea non-metal material, e.g., Si or SiGe.

Referring to FIG. 50, the protection layer 133 disposed on the firstinterlayer insulation layer 131 is removed. To remove the protectionlayer 133, a planarization process may be performed. Therefore, thefirst and second gate structures 151 a and 151 b and the dummy gatestructure 152 may also be partially removed.

After removing the protection layer 133, the second interlayerinsulation layer 132 is formed. The second interlayer insulation layer132 may cover the first interlayer insulation layer 131, the first andsecond gate structures 151 a and 151 b and the dummy gate structure 152.

Next, a silicide layer 161 is formed on the first to third source/drainregions 121, 123 and 125 and a contact 163 is formed on the silicidelayer 161, thereby fabricating the semiconductor device 1 shown in FIGS.1 to 4.

A method for fabricating a semiconductor device 2 according to someembodiments of present inventive concepts will be described withreference to FIGS. 5, 30 to 49, and 51 to 53. FIGS. 51 to 53 illustrateintermediate process operations of a method for fabricating asemiconductor device 2 according to some embodiments of presentinventive concepts. FIGS. 30 to 49 have already been described above,and repeated descriptions thereof may be omitted.

Referring to FIG. 51, portions of the first and second gate structures151 a and 151 b and the dummy gate structure 152 are removed. Theprotection layer 133 may protect the first interlayer insulation layer131 from being etched.

Referring to FIG. 52, a cover layer 169 a is formed on the resultantproduct of FIG. 51. The cover layer 169 a covers the first and secondgate structures 151 a and 151 b and the dummy gate structure 152. Thecover layer 169 a may include, for example, at least one of SiCN, SiN,SiON, SiCON and SiCO.

Referring to FIG. 53, portions of the cover layer 169 a are removed soas to cover only the first and second gate structures 151 a and 151 band the dummy gate structure 152. At this time, the protection layer 133is also removed to expose the first interlayer insulation layer 131.Sidewalls of the cover layer 169 a may be covered by the first spacer115. To remove the protection layer 133 and the portions of the coverlayer 169 a, a planarization process may be performed.

Next, the second interlayer insulation layer 132, the silicide layer 161and the contact 163 are formed, thereby fabricating the semiconductordevice 2 shown in FIG. 5.

A method for fabricating a semiconductor device 3 according to someembodiments of present inventive concepts will be described withreference to FIGS. 6, 30 to 42, and 54 to 59. FIGS. 54 to 59 illustrateintermediate process operations of a method for fabricating asemiconductor device 3 according to some embodiments of presentinventive concepts. FIGS. 30 to 42 have already been described above,and repeated descriptions thereof may be omitted.

Referring to FIG. 54, an etch mask pattern 137 is formed on theresultant product of FIG. 42. Next, an etching process is performedusing the etch mask pattern 137, thereby forming a first recess 141 a.To form the first recess 141 a, the protection layer 133 disposed on thesecond sacrificial gate structure 111 b and the second sacrificial gatestructure 111 b are sequentially etched. The first recess 141 a exposesportions of the first to third fins F1 to F3.

Referring to FIG. 55, an inner spacer 170 a is formed. The inner spacer170 a may be conformally formed along a top surface and sidewalls of theetch mask pattern 137, sidewalls of the first spacer 115 and topsurfaces of the first to third fins F1 to F3. The inner spacer 170 a mayinclude at least one of an oxide layer, a nitride layer and anoxynitride layer.

Referring to FIG. 56, the inner spacer 170 a is etched to expose thefirst to third fins F1 to F3 again. The inner spacer 170 a may remain onthe sidewalls of the etch mask pattern 137 and the sidewalls of thefirst spacer 115 by, for example, an etch-back process. The inner spacer170 a may be disposed on the sidewalls of the first recess 141 a.

Referring to FIG. 57, the first to third fins F1 to F3 are etched,thereby forming a second recess 141 b under the first recess 141 a. Thesecond recess 141 b may be formed using the etch mask pattern 137, thefirst spacer 115 and the inner spacer 170 a as etch masks.

While the second recess 141 b is formed, a portion of the first spacer115 and a portion of the inner spacer 170 a may also be etched, thusforming an inner spacer 170. Accordingly, a height of the inner spacer170 may be shorter than a height of the first spacer 115, and a width W3between opposing portions of the inner spacer 170 may be narrower than awidth W4 between opposing etched portions of the first spacer 115. Aprofile of the inner spacer 170 and a profile of the second recess 141 bmay be connected.

A bottom surface of the second recess 141 b may be lower than bottomsurfaces of the first to third source/drain regions 121, 123 and 125.

In addition, while the first and second recesses 141 a and 141 b areformed, the etch mask pattern 137, the insulation layer 135 and theprotection layer 133 may also be removed.

Referring to FIG. 58, a capping layer 142 a and a device isolation layer143 a are sequentially formed. The capping layer 142 a may be formedalong inner surfaces of the first and second recesses 141 a and 141 b.In detail, the capping layer 142 a may be conformally formed along a topsurface and sidewalls of the first spacer 115, a top surface andsidewalls of the inner spacer 170, and an inner surface of the secondrecess 141 b. The device isolation layer 143 a may be formed on thecapping layer 142 a and may fill the remaining portions of the firstrecess 141 a and the second recess 141 b.

The capping layer 142 a may include at least one of an oxide layer, anitride layer and an oxynitride layer, and the device isolation layer143 a may include at least one of an oxide layer, a nitride layer and anoxynitride layer.

Referring to FIG. 59, portions of the capping layer 142 a and the deviceisolation layer 143 a are removed so as to be disposed only in the firstand second recesses 141 a and 141 b, as a capping layer 142 and a deviceisolation layer 143, respectively. Next, a portion of the deviceisolation layer 143 is removed. Therefore, the device isolation layer143 may fill only a portion of the first recess 141 a. In FIG. 59, thetop surface of the device isolation layer 143 is illustrated as beinghigher than the top surface of the inner spacer 170, but aspects ofpresent inventive concepts are not limited thereto. The top surface ofthe device isolation layer 143 may be lower than the top surface of theinner spacer 170 in some embodiments.

When the capping layer 142 includes a different material from the deviceisolation layer 143, it may not be significantly etched/removed whileremoving the portion of the device isolation layer 143.

Next, the first and third sacrificial gate structures 111 a and 111 care replaced with the first and second gate structures 151 a and 151 b,the dummy gate structure 152 is formed on the device isolation layer143, the second interlayer insulation layer 132 is formed, and thesilicide layer 161 and the contact 163 are formed, thereby fabricatingthe semiconductor device 3 shown in FIGS. 6 and 7.

A method for fabricating a semiconductor device 5 according to someembodiments of present inventive concepts will be described withreference to FIGS. 9, 10, 30 to 42 and 60 to 65. FIGS. 60 to 65illustrate intermediate process operations of a method for fabricating asemiconductor device 5 according to some embodiments of presentinventive concepts. FIGS. 30 to 42 have already been described above,and repeated descriptions thereof may be omitted.

Referring to FIG. 60, the protection layer 133 is partially removed toexpose first to third sacrificial gate structures 111 a, 111 b and 111c. To expose the first to third sacrificial gate structures 111 a, 111 band 111 c, a planarization process may be performed.

Referring to FIG. 61, the first to third sacrificial gate structures 111a, 111 b and 111 c are removed.

Next, a gate insulation layer 153 and a barrier layer 154 aresequentially stacked. In detail, the gate insulation layer 153 may beformed along sidewalls of a first spacer 115 and top surfaces of firstto third fins F1 to F3. The gate insulation layer 153 may include ahigh-k material having a higher dielectric constant than a silicon oxidelayer. For example, the gate insulation layer 153 may include HfO₂,ZrO₂, LaO, Al₂O₃ or Ta₂O₅.

The barrier layer 154 may be disposed on the gate insulation layer 153and may be formed along the sidewalls of the first spacer 115 and thetop surfaces of the first to third fins F1 to F3, like the gateinsulation layer 153. The barrier layer 154 may include, for example,TiN.

Next, an etch mask pattern 137 is formed. The etch mask pattern 137exposes a portion of a second sacrificial gate structure 111 b whilefilling portions of first and third sacrificial gate structures 111 aand 111 c.

Referring to FIG. 62, first and second recesses 141 a and 141 b areformed. In detail, the first recess 141 a is formed by removing portionsof the gate insulation layer 153 and the barrier layer 154 that areexposed by the etch mask pattern 137. The gate insulation layer 153 andthe barrier layer 154 are removed by an etch-back process. Portions ofthe gate insulation layer 153 and the barrier layer 154 that aredisposed on the sidewalls of the first spacer 115 may be allowed toremain, and the first to third fins F1 to F3 may be exposed. The gateinsulation layer 153 may have an L shape and the barrier layer 154 maybe disposed on the gate insulation layer 153.

Next, the second recess 141 b is formed in the first to third fins F1 toF3. The second recess 141 b may be formed using the gate insulationlayer 153 and the barrier layer 154 (e.g., using the gate insulationlayer 153 and the barrier layer 154 as etch masks). Due to the presenceof the gate insulation layer 153 and the barrier layer 154, a width ofthe second recess 141 b is narrower than that of the second sacrificialgate structure 111 b. Moreover, the second recess 141 b is spaced apartfrom the first to third source/drain regions 121, 123 and 125.

Referring to FIG. 63, the etch mask pattern 137 is removed, and an etchstop layer 138 is formed. The etch stop layer 138 may fill the secondrecess 141 b, a portion of the first recess 141 a, and regions resultingafter the first and third sacrificial gate structures 111 a and 111 care removed.

Referring to FIG. 64, the gate insulation layer 153 and the barrierlayer 154 are partially removed to form the first and second gateinsulation layers 153 a and 153 b, the dummy gate insulation layer 153c, and the barrier layer 154. Portions of the gate insulation layer 153and the barrier layer 154 positioned higher than a top surface of theetch stop layer 138 are removed. The top surfaces of the first andsecond gate insulation layers 153 a and 153 b, the dummy gate insulationlayer 153 c and the barrier layer 154 may be coplanarly positioned withthe top surface of the etch stop layer 138.

Referring to FIG. 65, the etch stop layer 138 is removed. Next, a firstgate electrode 155 a is formed on the first gate insulation layer 153 a,a second gate electrode 155 b is formed on the second gate insulationlayer 153 b, and a dummy gate electrode 155 c is formed on the dummygate insulation layer 153 c. Then, first and second gate structures 151d and 151 e and a dummy gate structure 152 may be formed.

The dummy gate electrode 155 c may fill the second recess 141 b. Inparticular, a first metal layer MG1 of the dummy gate electrode 155 cmay fill the second recess 141 b.

Next, the second interlayer insulation layer 132, the silicide layer 161and the contact 163 are formed, thereby fabricating the semiconductordevice 5 shown in FIGS. 9 and 10.

The semiconductor device 6 shown in FIG. 11 may be fabricated byadditionally forming a cover layer 169 on the first and second gatestructures 151 d and 151 e and the dummy gate structure 152 of FIGS. 9and 10.

A method for fabricating a semiconductor device 8 according to someembodiments of present inventive concepts will be described withreference to FIGS. 14 to 16, 30 to 39, and 66 to 78. FIGS. 66 to 78illustrate an intermediate process operation of a method for fabricatinga semiconductor device 8 according to some embodiments of presentinventive concepts. FIGS. 30 to 39 have already been described above,and repeated descriptions thereof may be omitted.

Referring to FIG. 66, a first etch mask pattern 137 is formed on theresultant product of FIG. 39 and a second etch mask pattern 139 isformed on the first etch mask pattern 137. To more elaborately andaccurately perform an etching process, multiple etch masks may beformed.

To form the second etch mask pattern 139, a second etch mask layer isfirst formed and a photoresist pattern is then formed on the second etchmask layer, thereby patterning the second etch mask layer using thephotoresist pattern. Accordingly, the second etch mask pattern 139 maybe formed by patterning the second etch mask layer.

Meanwhile, as shown in FIG. 67, after forming the second etch maskpattern 139, a first mask spacer 1139 may be formed on sidewalls of thesecond etch mask pattern 139. The forming of the first mask spacer 1139may protect/prevent the second etch mask pattern 139 from collapsingwhen patterning the first etch mask layer 137.

Next, as shown in FIG. 68, the first etch mask layer 137 is patternedusing the second etch mask pattern 139. As a result, a first etch maskpattern 137 is formed, and a second hard mask layer 113 b (e.g., asillustrated in FIG. 39) is exposed.

Next, the second etch mask pattern 139 disposed on the first etch maskpattern 137 is removed.

As shown in FIG. 69, after forming the first etch mask pattern 137, asecond mask spacer 1137 may be formed on sidewalls of the first etchmask pattern 137. The forming of the second mask spacer 1137 mayprotect/prevent the first etch mask pattern 137 a from collapsing in asubsequent process.

Referring to FIG. 70, the second hard mask layer 113 b and the secondsacrificial gate structure 111 b are sequentially removed using thefirst etch mask pattern 137. The exposed second hard mask layer 113 b isfirst removed to expose a top surface of the second sacrificial gatestructure 111 b, followed by removing the second sacrificial gatestructure 111 b. The first recess 141 a may be formed by removing thesecond sacrificial gate structure 111 b, and first to third fins F1 toF3 are exposed by the first recess 141 a.

Referring to FIGS. 71 and 72, an inner spacer 170 a is formed in thefirst recess 141 a. First, as shown in FIG. 71, the inner spacer 170 ais formed along a top surface and sidewalls of the first etch maskpattern 137, a top surface and sidewalls of the first spacer 115, andtop surfaces of the first to third fins F1 to F3. Next, as shown in FIG.72, portions of the inner spacer 170 a are removed by, for example, anetch-back process, thus providing an inner spacer 170 remaining only onthe sidewalls of the first etch mask pattern 137 and the sidewalls ofthe first spacer 115. Accordingly, the first to third fins F1 to F3 arealso exposed.

Referring to FIG. 73, the exposed first to third fins F1 to F3 areetched to form the second recess 141 b. The second recess 141 b may beformed using the first etch mask pattern 137 and the inner spacer 170 asetch masks. A width of the second recess 141 b may be adjusted byadjusting a width of the inner spacer 170. A bottom surface of thesecond recess 141 b is lower (e.g., closer to a surface of the substrate101) than bottom surfaces of first to third source/drain regions 121,123 and 125.

Referring to FIG. 74, the inner spacer 170 is removed and the cappinglayer 173 a and the device isolation layer 175 a are then formed. Thecapping layer 173 a may be formed along a top surface and sidewalls ofthe first etch mask pattern 137, a top surface and sidewalls of thefirst spacer 115, and an inner surface of the second recess 141 b. Thedevice isolation layer 175 a may fill the remaining portions of thefirst and second recesses 141 a and 141 b.

For example, the capping layer 173 a may include at least one of asilicon oxide layer, a silicon nitride layer, and a silicon oxynitridelayer, and the device isolation layer 175 a may include at least one ofa silicon oxide layer, a silicon nitride layer, and a silicon oxynitridelayer.

Referring to FIG. 75, portions of the device isolation layer 175 a andthe capping layer 173 a are removed, and the device isolation layer 175and the capping layer 173 are disposed only in the first and secondrecesses 141 a and 141 b. The first and third hard mask layers 113 a and113 c may be exposed.

Next, referring to FIG. 76, a cleaning process is performed. As a resultof the cleaning process, a portion of the first interlayer insulationlayer 131 and a portion of the device isolation layer 175 may be etched.

Referring to FIG. 77, a protection layer 133 is formed on the resultantdevice/product of FIG. 76. The protection layer 133 may be formed tohave a uniform thickness. Accordingly, the protection layer 133 may havea recessed portion thereof formed on the first interlayer insulationlayer 131. The protection layer 133 may include at least one of anitride layer and an oxynitride layer. Next, an insulation layer 135filling the recessed portion of the protection layer 133 is formed. Theinsulation layer 135 may include the same material as the firstinterlayer insulation layer 131.

Next, the first and third hard mask layers 113 a and 113 c are exposedthrough planarization. The protection layer 133 may cover the firstinterlayer insulation layer 131 and the device isolation layer 175.

Referring to FIG. 78, the first and third hard mask layers 113 a and 113c are removed by, for example, planarization. The first and thirdsacrificial gate structures 111 a and 111 c are replaced with the firstand second gate structures 151 a and 151 b. A dummy gate structure isnot formed on the device isolation layer 175. Since the first and secondgate structures 151 a and 151 b are the same as described above,detailed descriptions thereof will not be given.

Next, the protection layer 133 is removed, the second interlayerinsulation layer 132 is formed, and the silicide layer 161 and thecontact 163 are formed, thereby fabricating the semiconductor device 8shown in FIGS. 14 to 16.

A method for fabricating a semiconductor device 9 a according to someembodiments of present inventive concepts will be described withreference to FIGS. 17, 18, 30 to 39, and 66 to 79. FIG. 79 illustratesan intermediate process operation of a method for fabricating asemiconductor device 9 a according to some embodiments of presentinventive concepts. FIGS. 30 to 39 and 66 to 73 have already beendescribed above, and repeated descriptions thereof may be omitted.

Referring to FIG. 79, the capping layer 173 a and the device isolationlayer 175 a are formed without removing the inner spacer 170. Thecapping layer 173 a may be formed along a top surface of the first etchmask pattern 137, a top surface and sidewalls of the inner spacer 170,and an inner surface of the second recess 141 b. The device isolationlayer 175 a may fill the remaining portions of the first and secondrecesses 141 a and 141 b.

Next, the same process operations of the fabricating method as shown inFIGS. 74 to 78 are performed, thereby fabricating the semiconductordevice 9 a shown in FIGS. 17 and 18.

A method for fabricating a semiconductor device 10 according to someembodiments of present inventive concepts will be described withreference to FIGS. 23, 24, 30 to 39, 66 to 72, and 80 to 82. FIGS. 80 to82 illustrate intermediate process operations of a method forfabricating a semiconductor device 10 according to some embodiments ofpresent inventive concepts. FIGS. 30 to 39 and 66 to 72 have alreadybeen described above, and repeated descriptions thereof may be omitted.

Referring to FIG. 80, the exposed first to third fins F1 to F3 areetched to form the second recess 141 b. Here, portions of the spacers116 and 117 disposed on opposite sides of the first recess 141 a and theinner spacer 170 may be etched. Accordingly, the spacers 116 and 117 mayhave L shapes facing each other, and top widths of the spacers 116 and117 are smaller than bottom widths thereof. The inner spacer 170 doesnot cover the second recess 141 b but is disposed on sidewalls of thespacers 116 and 117. A height of the inner spacer 170 may be smallerthan heights of the spacers 116 and 117.

As the portions of the spacers 116 and 117 and the inner spacer 170 areetched, a shape of the first recess 141 a may vary. A width W5 of thefirst recess 141 a between the inner spacer 170 is smaller than a widthW6 between the spacers 116 and 117 where the inner spacer 170 is notdisposed.

Next, the etch mask pattern 137 is removed.

Referring to FIG. 81, the capping layer 173 a and the device isolationlayer 175 a are sequentially formed in the first and second recesses 141a and 141 b.

Referring to FIG. 82, the capping layer 173 a and the device isolationlayer 175 a are partially removed to expose the first interlayerinsulation layer 131 and the first to third hard mask layers 113 a and113 c. The capping layer 173 and the device isolation layer 175 aredisposed only in the first and second recesses 141 a and 141 b, afterpartially removing the capping layer 173 a and the device isolationlayer 175 a.

Next, the first to third hard mask layers 113 a and 113 c are removed,and the first and third sacrificial gate structures 111 a and 111 c arereplaced with the first and second gate structures 151 a and 151 b, andthe second interlayer insulation layer 132, the silicide layer 161 andthe contact 163 are formed, thereby fabricating the semiconductor device10 shown in FIGS. 23 and 24.

Next, a method for fabricating a semiconductor device 11 according tosome embodiments of present inventive concepts will be described withreference to FIGS. 25, 26, 30 to 39 and 83 to 86.

FIGS. 83 to 86 illustrate intermediate process operations of a methodfor fabricating a semiconductor device 11 according to some embodimentsof present inventive concepts.

FIGS. 30 to 39 have already been described above, and repeateddescriptions thereof may be omitted.

Referring to FIG. 83, an etch mask pattern 137 is formed on theresultant product of FIG. 39. The etch mask pattern 137 exposes topsurfaces of spacers 116 and 117 disposed on opposite sidewalls of asecond sacrificial gate structure 111 b and a portion of the firstinterlayer insulation layer 131.

Referring to FIG. 84, the first recess 141 a is formed by removing thesecond sacrificial gate structure 111 b. The first recess 141 a exposesportions of the first to third fins F1 to F3. Next, the inner spacer 170is formed on sidewalls of the spacers 116 and 117. The inner spacer 170may also be formed on sidewalls of the etch mask pattern 137.

Referring to FIG. 85, the second recess 141 b is formed in each of thefirst to third fins F1 to F3. In the course of forming the second recess141 b, a portion of the first interlayer insulation layer 131, portionsof the spacers 116 and 117 disposed at opposite sides of the firstrecess 141 a and a portion of the inner spacer 170 may be etched.Heights of the spacers 116 and 117 are greater than a height of theinner spacer 170, but aspects of present inventive concepts are notlimited thereto. For example, when the spacers 116 and 117 and the innerspacer 170 include the same material, the heights of the spacers 116 and117 may be equal to the height of the inner spacer 170.

A height of the first spacer 115 formed on sidewalls of the first andthird sacrificial gate structures 111 a and 111 c may be taller thanheights of the spacers 116 and 117 formed on opposite sides of the firstrecess 141 a.

Referring to FIG. 86, a capping layer 173 and a device isolation layer175 may be sequentially formed in the first and second recesses 141 aand 141 b. The capping layer 173 may be formed along sidewalls of thefirst interlayer insulation layer 131, top surfaces and sidewalls of thespacers 116 and 117, a top surface and sidewalls of the inner spacer 170and an inner surface of the second recess 141 b, and the deviceisolation layer 175 may fill remaining portions of the first and secondrecesses 141 a and 141 b that are not filled by the capping layer 173.

The device isolation layer 175 may cover the top surfaces of the spacers116 and 117 disposed on opposite sides of the first recess 141 a. Thedevice isolation layer 175 may have a first region 175 a disposedbetween opposing portions of the inner spacer 170, a second region 175 bbetween the spacers 116 and 117 disposed on the first region 175 a, anda third region 175 c between opposite sides of the first interlayerinsulation layer 131 disposed on the second region 175 b. A width W7 ofthe first region 175 a may be smaller than or equal to a width W8 of thesecond region 175 b, and the width W8 of the second region 175 b may besmaller than or equal to a width W9 of the third region 175 c.

Next, the second interlayer insulation layer 132 is formed on theresultant product of the FIG. 86, the silicide layer 161 is formed andthe contact 163 is then formed, thereby fabricating the semiconductordevice 11 shown in FIGS. 25 and 26.

The above-disclosed subject matter is to be considered illustrative, andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments, which fall withinthe true spirit and scope. Thus, to the maximum extent allowed by law,the scope is to be determined by the broadest permissible interpretationof the following claims and their equivalents, and shall not berestricted or limited by the foregoing detailed description.

What is claimed is:
 1. A semiconductor device comprising: a substratecomprising a first region and a second region; a first fin protrudingfrom the substrate and extending in a first direction on the firstregion; a recess extending in a second direction different from thefirst direction in the first fin; a dummy gate structure overlapping therecess and extending in the second direction; second and third fins onthe second region, protruding from the substrate, and extending in thefirst direction; and a trench between the second fin and the third finsuch that the second fin and the third fin are spaced apart from eachother, wherein a height and a width of the recess are smaller than thoseof the trench.
 2. The semiconductor device of claim 1, wherein theheight of the recess is smaller than that of the fin and the height ofthe trench is greater than that of the fin.
 3. The semiconductor deviceof claim 1, further comprising a first device isolation layer fillingthe recess and a second device isolation layer filling the trench. 4.The semiconductor device of claim 3, further comprising a capping layerbetween the recess and the first device isolation layer which isconformally formed along an inner surface of the recess.
 5. Thesemiconductor device of claim 3, wherein the second device isolationlayer include the same material as the first device isolation layer. 6.The semiconductor device of claim 1, wherein the first region is amemory region and the second region is a core/periphery region.
 7. Thesemiconductor device of claim 1, wherein the first region is a StaticRandom Access Memory (SRAM) region and the second region is a logicregion.